解决方案

概述

Overview

中海启航科技（北京）有限公司自动化晶圆测试系统，通过温控承片台及真空系统实现对温度和压力的控制，显微成像系统结合多自由度位移台实现对晶片上各网络节点与探针的对位，芯片信号通过探针座经测试电缆与外部专用测试仪器连接最终显示芯片电学性能测试结果，工控计算机实现对整个探针台及测试仪器的控制及数据采集。

The automatic wafer test system of China Sailingtek Company Limited realizes the control of temperature and pressure through the temperature-controlled wafer stage and vacuum system. The microscopic imaging system and the multi-degree-of-freedom displacement stage realize the alignment of all network node and probe on the wafer. Probe set is connected to an external special test instrument by a test cable. Chip signals is transferred by probe set, test cable and test instrument. The test result of the chip signal is finally displayed. The industrial control computer realizes control and data acquisition on the whole probe station and the test instrument.

组成

Composition

    由罗德与施瓦茨的矢量网络分析仪、频谱分析仪等射频仪表、FormFactor 的探针台、电缆、适配器和晶圆探针组成的测量系统。

Measurement system consisting of RF instruments such as Rohde & Schwarz vector network analyzers, spectrum analyzers, FormFactor probe stations, cables, adapters and wafer probes.

测试界面

Test interface

探针台进行扎针测试

Probe station for needle insertion test